(PCBs are custom-made products, the picture and parameters shown are just for reference)
Introduction
Hello Everyone,
Warm greetings!
Today, we will discuss a 4-layer hybrid PCB that combines 8mil (0.203mm) RO4003C and FR-4, designed specifically for attenuator applications. This PCB has a thickness of 1.1 mm and features a blue solder mask with immersion silver plating on the pads, along with 1oz copper on each layer. Overall, it represents a straightforward multilayer PCB with a hybrid structure. These boards are manufactured according to IPC 6012 Class 2 standards using the provided Gerber data. Each board undergoes 100% electrical testing prior to delivery, with 25 boards packed for shipment.
Let’s look the stack-up:
The stack-up consists of layers from 1 to 2 made of the fixed thickness RO4003C core (8mil), which is crucial for maintaining the electrical length of RF lines on the circuit board. The remaining layers utilize FR-4 materials, and all boards feature through holes.
Below is a micro-section drawing:
Features and Benefits
1.Stable Dielectric Constant: RO4003C provides a consistent dielectric constant across a wide frequency range, making it an ideal substrate for broadband applications.
2.Improved Signal Integrity: This hybrid stack-up enhances signal integrity compared to traditional all-FR-4 constructions.
3.Certifications: Our manufacturing processes are ISO9001, ISO14001, IATF16949, ISO13485, and UL certified.
4.Comprehensive Testing: We conduct thermal stress, reliability, insulation resistance, ionic contamination, and AOI tests to ensure quality.
5.No Minimum Order Quantity (MOQ): We accommodate both small and large orders without minimum requirements.
6.Extensive Experience: With over 19 years in high-frequency PCB manufacturing, we bring expertise to your projects.
7.Production Capabilities: Our workshop spans 16,000㎡, with a monthly output capability of 30,000㎡ and the ability to produce 8,000 different PCB types monthly.
8.Support for R&D: Our robust PCB capabilities enhance your research and development, sales, and marketing efforts.
Applications
RF Transceiver
Power Divider
LNB Attenuator
Directional Coupler
Photocoupler
Parameter and Data Sheet
PCB SIZE |
140 x 35 mm=1PCS |
BOARD TYPE |
Multilayer PCB |
Number of Layers |
4 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 35um TOP layer |
RO4003C 0.203mm |
|
copper ------- 35um(1oz) MidLayer 1 |
|
FR-4 0.5mm |
|
copper ------- 35um(1oz) MidLayer 2 |
|
FR-4 0.2mm |
|
copper ------- 35um BOT layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
7.8 mil / 4.4 mil |
Minimum / Maximum Holes: |
0.3 mm / 2.5 mm |
Number of Different Holes: |
4 |
Number of Drill Holes: |
91 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
Rogers RO4003C +FR4 hybrid material |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
1.1 mm ±0.11 |
PLATING AND COATING |
|
Surface Finish |
Immersion silver |
Solder Mask Apply To: |
TOP and Bottom, 12micron Minimum |
Solder Mask Color: |
Blue, KSM-6189BL04/KSM-19H01 |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
NO |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
NO |
VIA |
Plated through hole(PTH), minimum size 0.3mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |